Shiny Li
Jan 20,2016
276
Cure
Change of physical properties of a material via chemical reaction or heat and catalysts, usually from a liquid ...
Shiny Li
Jan 20,2016
393
C-stage Material Laminate:
The condition of a resin polymer when it is in the solid-state, with high molecular weight, being insoluble an...
Shiny Li
Jan 20,2016
242
Cross-talk:
The undesirable interference caused by the coupling of energy between single paths.
Shiny Li
Jan 20,2016
250
Cross-linking
The formation of chemical ties between reactive atoms in the molecular chain of a plastic.
Shiny Li
Jan 20,2016
215
Cross-hatching
The breaking of large conductive areas by use of a pattern of voids in the conductive material.
Shiny Li
Jan 20,2016
245
Crimp Contact
A type of connector contact whose end is a hollow cylinder that can be crimped onto a wire inserted within it.
Shiny Li
Jan 20,2016
1547
Crazing
A condition existing in the base material in the form of connected white spots or “crosses” on or below the surface of the base material, reflecting the separation of fibres in the glass cloth and con...
Shiny Li
Jan 20,2016
265
Cracking
A condition that makes breaks or separations in coatings that extends through to an underlying surface.
Shiny Li
Jan 20,2016
437
Cover Lay, Cover Layer, Cover Coat
An outer layer(s) of insulating material applied over the conductive pattern on the surface of the printed board.
Shiny Li
Jan 20,2016
301
Coupon
One of the patterns of the quality conformance test circuitry area. (See: also Test Coupon).
Shiny Li
Jan 20,2016
449
Cosmetic Defects
A smear or stain on the board representing flux residue after soldering and a variation from conventional appearance.
Shiny Li
Jan 20,2016
315
Corrosive Fluxes
Materials of inorganic acids and salts for surfaces of difficult solderability. Also called acid fluxes.
Shiny Li
Jan 20,2016
259
Corner Mark
Marks placed inside the edges of PCB corners to align and register the layers.
Shiny Li
Jan 20,2016
256
Copper-mirror Test
A corrosivity test for fluxes in which the compound’s reaction to a copper film vacuum-deposited on a glass plate is noted.
Shiny Li
Jan 20,2016
318
Copper Foil-See Foil
Quality electrolytic copper used to form conductive patterns on printed circuits. It is available in a number of weights (thickness) the traditional weights are 0.5, 1 and 2 ounces per square foot. (1...
Shiny Li
Jan 20,2016
308
Copper Clad
A material, usually supplied in large sheets, consisting of a base material to one or both sides of which a thin copper foil is boned. Synonym: laminate.
Shiny Li
Jan 20,2016
259
Continuity Testing
A procedure in which voltage is applied to two interconnected lands to ascertain the presence or absence of current flow.
Shiny Li
Jan 20,2016
0
Contaminate/Contaminant
An impurity or foreign substance whose presence on printed wiring assemblies could electrolytically, chemically, or galvanically corrode the system.
Shiny Li
Jan 20,2016
230
Contact Spacing
The distance between the centre lines of adjacent contact areas.
Shiny Li
Jan 20,2016
282
Contact Resistance
The electrical resistance of the metallic surfaces at their interface in the contact area under specified conditions.
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