Shiny Li
Jan 20,2016
380
Chamfer
A corner which has been rounded or shaped to eliminate an otherwise sharp edge.
Shiny Li
Jan 20,2016
358
Catalyst
A chemical that speeds or changes the cure of a resin but does not become a part of the final product. Examples: hardeners, promoters, inhibitors.
Shiny Li
Jan 20,2016
224
Cast Adhesive
Special sheet adhesive material used for bonding polyimide multi-layer boards and flexi-rigids ( similar to prepreg = B-Stages ).
Shiny Li
Jan 20,2016
417
Capillary Action
A phenomenon of force adhesion and cohesion that prompts liquids ( molten solder) to flow against gravity between closely spaced solid surface, such as component leads and pads.
Shiny Li
Jan 20,2016
341
Capacitive Coupling
The electrical interaction between two conductors caused by the capacitance between them.
Shiny Li
Jan 20,2016
0
CAD/CAM system
Computer-aided design is the use of special software tools to formulate printed circuit patterns. Computer-aided manufacturing translates such designs into actual products.
Shiny Li
Jan 20,2016
248
CAD system
Computer-aided design that permits the interactive use of computers, programs and procedures in the design process. Decisions are made by the operator while the computer provides the data manipu...
Shiny Li
Jan 20,2016
240
Bypass Capacitor
A capacitor which provides a comparatively low impedance ac (alternating current ) around a circuit element.
Shiny Li
Jan 20,2016
243
Bus
A heavy trace or conductive metal strip on the printed circuit board used to distribute voltage, grounds, etc., to smaller branch trances.
Shiny Li
Jan 20,2016
353
Bus Bar
A conduit, such as a conductor on a printed board, for distributing electrical energy.
Shiny Li
Jan 20,2016
272
Burn-in
A method of testing devices via electrical stress vs temperature and/or time so that units prone to failure are eliminated.
Shiny Li
Jan 20,2016
305
Buried Via
A via that does not reach a surface layer on either side of a multi-layer board. The via transcends only inner layers of the board.
Shiny Li
Jan 20,2016
580
Bulge
A swelling of a printed board that is usually caused by internal de-lamination or separation of fibres.
Shiny Li
Jan 19,2016
599
B-stage
( prepreg ) Partially cured resin ( mostly reinforced with glass cloth ) which will soften under a special&nbs...
Shiny Li
Jan 19,2016
403
B-stage Resin
A resin in an intermediate state of cure. The cure is normally completed during the laminating cycle.
Shiny Li
Jan 19,2016
411
Bridging
A condition where excess solder builds up in the air gap between conductors and causes them to short together....
Shiny Li
Jan 19,2016
250
Bridged Joint
Solder that spans across two or more conductors causing an electrical short-circuit.
Shiny Li
Jan 19,2016
313
Breakdown Voltage
The voltage at which an insulator or dielectric ruptures or at which ionization and conduction take place in a...
Shiny Li
Jan 19,2016
233
Brazing Alloy
A metal alloy (solder) which melts above 450℃ but below metals being joined.
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