BGA
Ball Grid Array. Leadless array packaging technology in which solder balls are mounted to the underside of the ...
Bellows Contact
A connector contact which is a flat sprint folded to provide a uniform spring rate over the full tolerance ran...
Bed-of-Nails
A method of PCB testing involving a fixture containing a field of spring-loaded pins that are co-ordinated with&nbs...
Basic Wettability
The ease with which a metal or metal alloy can be wetted by molten solder.
Base Solderability
The ease with which a metal or metal alloy surface can be wetted by molten solder under minimum realistic ...
Base Material
The insulating material (either rigid or flexible ) as well as the copper foils bonded on one or both sid...
Base Material Thickness
The thickness of the base material, excluding metal foil or material deposited on the surface.
Base Laminate
The substrate material upon which the conductive wiring pattern may be formed.
Base Copper
The original, thin copper foil present on one or both sides of a copper clad laminate. During PCB manufacture,...
Bare Board
A PCB having all lines, pads and layers intact but without components installed. An unassembled PCB.
B-stage Material
Laminate impregnated with a resin and cured to an intermediate stage (B-stage resin ). Normally designated as prepr...
Azeotrope
Two or more polar and non-polar solvents that behave when mixed as a single solvent to remove polar and n...
Axial Lead
A lead extending out the end and along the axis of a resistor, capacitor or other axial part rather than&...
AWG
American Wire Gauge. A method of specifying wire diameter; the higher the number, the smaller the diameter.
Automatic Test Equipment
Hardware that automatically analyses functional or static parameters to evaluate performance degradation. It also performs fa...
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