Shiny Li
Jan 20,2016
241
Dummy Component
A mechanical package without the die, used to verify placement processes.
Shiny Li
Jan 20,2016
340
Dual Solder Wave
In wave soldering, the first wave’s multi-directional jet leaves solder on all contacted surfaces, followed by the ...
Shiny Li
Jan 20,2016
264
Drying Time
Within the re-flow process after pre-heat and before peak re-flow temperature wherein volatile materials escape from the...
Shiny Li
Jan 20,2016
451
Dry Film Resists
Coating material in the form of laminated photo-sensitive foils specifically designed for use in the manufacture of ...
Shiny Li
Jan 20,2016
424
Dross
Oxide and other contaminates which form on the surface of molten solder.
Shiny Li
Jan 20,2016
315
Drills
Solid, carbide cutting tools designed specifically for the fast removal of material in extremely abrasive, glass-epoxy m...
Shiny Li
Jan 20,2016
661
DRC
Design Rule Check: Checks the integrity of print (PCB) so that problems like short-circuits, unrouted nets, etc. ar...
Shiny Li
Jan 20,2016
388
Drag-out
A measure of cleaning solution lost via board emergence after immersion.
Shiny Li
Jan 20,2016
272
Drag Soldering
The making of soldered terminations by dipping the colder side of a supported printed board with through-hole mount...
Shiny Li
Jan 20,2016
368
Double-sided Board
A printed board with a conductive pattern on both sides.
Shiny Li
Jan 20,2016
342
Double-sided Assembly
A PCB with components mounted on both skies.
Shiny Li
Jan 20,2016
386
Documentation
Information on an assembly that explains the basic design concept, type and quantity of parts and materials, specia...
Shiny Li
Jan 20,2016
277
Disturbed Solder Connection
A solder connection that is characterized by the appearance that there was motion between the metals being joined&n...
Shiny Li
Jan 20,2016
247
Dispersent
A chemical added to the cleaning solution to improve its particulate-removal ability.
Shiny Li
Jan 20,2016
228
Discrete Component
A component which has been fabricated prior to its installation (i.e., resistors, capacitors, diodes, transistors, capacitors...
Shiny Li
Jan 20,2016
222
DIP Soldering
A process whereby printed boards are brought into contact with the surface of a static pool of molten solder&n...
Shiny Li
Jan 20,2016
232
Dimensional Stability
A measure of dimensional change cause by such factory as temperature, humidity, chemical treatment, age, or stress ...
Shiny Li
Jan 20,2016
357
Dimensional Hole
A hole in a printed board where the means of determining location is by co-ordinate values not necessarily coi...
Shiny Li
Jan 20,2016
332
Digitizing
Any method of reducing feature locations on a flat plane to digital representation of X-Y co-ordinates.
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