Shiny Li
Jan 28,2016
335
Hole Density
The quantity of holes in a printed circuit board per unit area.
Shiny Li
Jan 28,2016
378
Hole Breakout
A condition in which a hole is not completely surrounded by the land.
Shiny Li
Jan 28,2016
326
Hipot Test
Wherein the assembly or component undergoes a high potential (ac) current.
Shiny Li
Jan 28,2016
460
Heel，Bonding
The part of a lead adjacent to a termination that has been deformed by the edge of the bonding tool.
Shiny Li
Jan 28,2016
291
Heat Sink
Any device that absorbs and draws off heat from a hot object, radiating it into the surrounding atmosphere.
Shiny Li
Jan 28,2016
277
Heat and Pull
A de-soldering method using a device that grasps, heats and pulls the leads to be removed.
Shiny Li
Jan 28,2016
637
Haloing Mechanically
Induced fracturing or de-lamination on or below the surface of the base material, it is usually exhibited by a light area around holes, other machined areas, or both.
Shiny Li
Jan 28,2016
338
Halogenated Polyester
A polyester resin modified with halogens to reduce flammability.
Shiny Li
Jan 28,2016
417
Halides
Compounds containing fluorine, chlorine, bromine or iodine, which may be part of the activators in the flux system and must be cleaned.
Shiny Li
Jan 28,2016
506
Gull Wing Lead
A surface mounted device lead which flares outward from the device body.
Shiny Li
Jan 26,2016
292
Guided Probe Method
A technique for volume production of PCBs based on incoming inspection to catch the majority of device failures and inspection prior to populating, that will eliminate most manufacturing errors. ...
Shiny Li
Jan 26,2016
569
Ground Plane Clearance
Removed portions of a ground plane that serves to isolate it form a hole in the base material to which the plane is attached
Shiny Li
Jan 26,2016
364
Ground Plane
A conductor layer, or portion of a conductor layer, used as a common reference point for circuit returns, shielding, or heat sinking. All those areas, not consumed by traces or pads, of the PCB which ...
Shiny Li
Jan 26,2016
358
Grid
An orthogonal network of two sets of parallel, equidistant lines used for locating points on a printed circuit board.
Shiny Li
Jan 26,2016
425
Glob Top
A coating process in which a set portion of resin is dispensed on the top of a chip or board. After spreading over the entire surface ,it is cured to form a soild protective coating.
Shiny Li
Jan 26,2016
339
Class Transition Temperature
TG-value, temperature at which resin ceases to act as a solid, Till this temperature, no separation will take place between resin/copper/reinforcement.
Shiny Li
Jan 26,2016
336
Glass Epoxy
A material used to fabricate printed circuit boards. The base material (fibre-glass) is impregnated with an epoxy filler which then must have copper laminated to its outer surface to form the material...
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