Shiny Li
Jan 28,2016
476
Modifier
A chemically inert substance added to a resin to change its properties.
Shiny Li
Jan 28,2016
369
Mixed Component-Mounting Technology
A component mounting technology that uses both through-hole and surface-mounting technologies on the same packaging and interconnecting structure.
Shiny Li
Jan 28,2016
350
Mis-registration
The lack of dimensional conformity between successively produced features or terns.
Shiny Li
Jan 28,2016
392
Minor Defect
A defect which is not likely to reduce the usability of the unit for its intended purpose, It may be a departure from established standard having no significant bearing on the effective use or operati...
Shiny Li
Jan 28,2016
402
Minimum Electrical Spacing
The minimum allowable distance between adjacent conductors that is sufficient to prevent dielectric breakdown, between the conductors at any given voltage.
Shiny Li
Jan 28,2016
401
Mil
One thousandth (0.001) of an inch. Not to be confused with Mil (short for millimetre).1Inch=25.4mm; 1mil=0.0254mm.
Shiny Li
Jan 28,2016
498
Micro-strip
A type of transmission line configuration which consists of a conductor over a parallel ground plane, and separated by a dielectric.
Shiny Li
Jan 28,2016
449
Micro-sectioning
A destructive test procedure in which a section of specimen it cut and removed for close examination.
Shiny Li
Jan 28,2016
473
Metallization
A deposited or plated thin metallic film used for its protective or electrical properties.
Shiny Li
Jan 28,2016
341
Metal Clad Base Material
Base material covered with metal on one or both of its sides.
Shiny Li
Jan 28,2016
722
Meniscus
The contour or shape of molten solder as formed by surface tension forces in turn controlled by wetting.
Shiny Li
Jan 28,2016
351
Melting Range
The temperature range over which the solder alloy melts .An alloy with a single melting point, rather than a melting range, is known as a eutectic alloy .
Shiny Li
Jan 28,2016
451
MELF
A metal electrode leadless face surface mount component that is round with metallic cap terminations.
Shiny Li
Jan 28,2016
630
Measling
A condition existing in the base laminate in the form of discrete white sports or crosses below the surface of the base laminate, reflecting a separation of fibres in the glass cloth at the weave inte...
Shiny Li
Jan 28,2016
556
Mean Time between Failure (MTBF)
The statistical mean average time interval, usually in hours, that may be expected between failures of an operating unit. Results should be designated actual. Predicted or calculated.
Shiny Li
Jan 28,2016
389
MCR
Moulded Carrier Ring. A tape of fine-pitch chip package named for the method of supporting and protecting the leads. The leads are left straight; the ends of the leads are embedded in a strip of plast...
Shiny Li
Jan 28,2016
422
Maximum, Plated Through-hole Size
A hole size equal to the specified hole size before plating, plus the manufacturing tolerance, less twice the minimum plating thickness.
Shiny Li
Jan 28,2016
446
Master Pattern
An accurately scaled pattern which is used to produce the printed circuit within the accuracy specified on the master drawing.
Shiny Li
Jan 28,2016
490
Master Drawing
A document that shows the dimensional limits or grid locations applicable to any or all parts of a printed board(rigid or flexible),including the arrangement of conductive and non-conductive patterns ...
Shiny Li
Jan 28,2016
294
Master Artwork
A document showing dimensional limits and grid locations for all parts of an assembly to be fabricated. It includes the arrangement of conductors and non-conductive patterns and the size, t...
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