Mass Soldering
Methods of soldering in which many joints are made in the same operation.
Mask
A material applied to enable selective etching, plating or the application of solder to a printed circuit board.
Margin
The distance between the reference edge of a flat cable and the nearest edge of the first conductor.(See also Edge Spacing)
MAR(Minimum Annular Ring)
The minimum metal width, at the narrowest point between the circumference of the hole and the outer circumference of the land. This measurement is made to the drilled hole on internal layers of multi-...
Major Defect
A defect that could result in failure or significantly reduce the usability of the part for its intended purpose.
Logic diagram
A drawing that depicts the multi-state device implementation of logic functions with logic symbols and supplementary notations, showing details of signal flow and control, but not necessarily the poin...
Locating Hole, Locating Notch, Locating Slot
A hole,notch or slot in the panel or printed board to enable it to be positioned accurately during manufacture and/or assembly. Synonyms: fabrication hole (or notch or slot),indexing hole, location ho...
Locating Edge, Locating Hole, Locating Notch, Locating Slot
A physical feature in a panel or printed board used to position the board or mounted components accurately.
Load Test
A mass re-flow soldering system test for the capacity repeatedly to process boards regardless of their volume though the oven.
Liquation
If a solder alloy with a long melting range is heated too slowly. the phase with the lowest melting point begins to flow first. The material left behind has a changed composition and a higher melting ...
Lifted Land
A land that has fully or partially separated (lifted)from the base material, whether or not any resin is lifted with land.
Legend
A format of lettering or symbols on the printed board, e.g. Part number, component locations, and patterns.
Lead Projection
The distance that a component lead protrudes through the side of a board that is opposite from the one upon which the component is mounted.
Layer
One in a series of levels in a board on which tracks are arranged to connect components. Vias connect tracks and zones between layers.
Ranking | Name | Answers |
---|