Shiny Li
Jan 28,2016
355
Layer-to-Layer Spacing
The thickness of dielectric material between adjacent layers of conductive circuitry in a multi-layer printed circuit board.
Shiny Li
Jan 28,2016
324
Land
On a PCB, the conductive area(s) to which components are attached. Also called pad.
Shiny Li
Jan 28,2016
316
Land Pattern
A combination of lands that is used to mount, interconnect and test a particular component.
Shiny Li
Jan 28,2016
297
Lamination
The process of manufacturing a laminate; also the process used for application of a dry film photo-resist.
Shiny Li
Jan 28,2016
304
Laminate Presses
Multi-layer equipment that applies both pressure and heat to laminate and prepreg to make multi-layer boards.
Shiny Li
Jan 28,2016
307
Laminate Void
Absence of laminate material in an area which normally contains laminate material.
Shiny Li
Jan 28,2016
315
Laminate Thickness
Thickness of the metal clad base material, single- or double-sided, prior to any subsequent processing.
Shiny Li
Jan 28,2016
286
Laminate
A product made by bonding together two or more layers of material.
Shiny Li
Jan 28,2016
298
Keyway
A slot used to assure the correct location in a mating connector.
Shiny Li
Jan 28,2016
381
Keying Slot or Polarizing Slot
A slot in a printed circuit board that polarizes it, thereby permitting it to be plugged into its mating receptacle with pins properly aligned, but preventing it from being reversed or plugged into an...
Shiny Li
Jan 28,2016
286
Key
A device designed to assure that the coupling of two components can occur in only one position.
Shiny Li
Jan 28,2016
263
Just-in-time(JIT)
Minimization of inventory by supplying material and components to the production line directly before placement into the product.
Shiny Li
Jan 28,2016
277
Jumper
An electrical connection between two points on a printed board added after the intended conductive pattern is formed.
Shiny Li
Jan 28,2016
258
J-leads
The preferred surface mount lead form used on PLCCs, so named because the lead departs the package body near its Z-axis centre-line, is formed down the rolled under the package. Leads so formed are sh...
Shiny Li
Jan 28,2016
296
Isolation
The clearance around a pad, track, zone or via that defines the nearest approach allowed by conductors of another signal set.
Shiny Li
Jan 28,2016
379
IPC
The Institute for Interconnecting and Packaging Electronic Circuits, an American organization.
Shiny Li
Jan 28,2016
732
Interstitial Via Hole
A plated through-hole connecting two or more conductor layers of a multilayer printed board but not extending fully through all the layers of base material comprising the board.
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