Permanent Mask
A resist which is not removed after processing, e.g., plating resist used in the fully-additive process.
Peel Strength
The force per unit width required to peel the conductor or foil from the base material.
Pattern
The configuration of all conductive and/or non-conductive areas on a PCB. Letters and inscription may also be included. Pattern also denotes the circuit configuration on related tools, drawing and mas...
Parylene
A polymer resin (Polyparaxylense) that provides a thin, uniform coating on PCBs and components. It can be applied via vacuum for deposition on sharp edges and complex shapes.
Panel
The base material containing one or more circuit patterns that passes successively through the production sequence and from which printed circuit boards are extracted. See Backplanes/Backpanels.
Pad
A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached. (Also called land).
Packaging Density
Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.
Overhang
Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.
Outgrowth
The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.
Outgassing
The gaseous emission from a laminate printed board or component when the board or the printed board assembly is exposed to heat or reduced air pressure or both.
Open
An area of a bare PCB which, due to over-etching or fabrication problems, separates two electrically connected points.
Omegameter
A test instrument measuring ionic residues on PCBs via the drop of resistivity over a specific time.
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