Statistical Process Control(SPC)
The use of statistical techniques to analyse the outputs of processes with the results guiding actions taken to adjust and/or maintain a state of quality control.
Stamped Printed Wiring
Wiring which is produced by die stamping and which is bonded to an insulating base.
Solderless Wrap
A method of connecting a solid wire to a square, rectangular, or V-shaped terminal by tightly wrapping the wire around the terminal with a special tool.
Soldering
A process of joining metallic surfaces with solder, without the melting of the base metals.
Soldering Iron Tip
The portion of a soldering iron that is used for the application of the heat that melts the solder.
Solderability Testing
The evaluation of a metal to determine its ability to be wetted by solder.
Solder Resist
An ink, lacquer, photo-resist or metal coating which is not wetted by molten solder. It is applied to specific areas of a PCB to stop them from being solder-coated, usually when mass soldering.
Solder Projection
An undesirable protrusion of solder from a solidified solder joint or coating.
Solder Paste
Finely divided particles of solder, with additives to promote wetting and to control viscosity, tackiness, drying rate, etc.
Solder oil (Blanket)
Liquid formulations that are used in intermix wave soldering and as coverings on static and wave soldering pots in order to eliminate dross and to reduce surface tension during the soldering process.
Solder Mask, Solder Resist
Coating with mask and insulate areas of a circuit pattern where solder is not desired.
Solder Masks
A screening defect characterized by prints having jagged edges, the result of incorrect moving pressure.
Solder Levelling
The process of immersing printed circuit boards into hot liquids. Often referred to as HASL or HAL (Hot Air Levelling).
Solder Fillet
A preferable concave surface of solder that is at the interconnection of the metal surfaces of a solder connection.
Solder Connection Pinhole
A small hole that penetrates from the surface of a solder connection to a void of indeterminate size within the solder connection (process indicator).
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