Shiny Li
Jan 28,2016
1323
Wetting
The formation of a relatively uniform, smooth, unbroken and adherent film of solder to a base material.
Shiny Li
Jan 28,2016
1948
Weave Exposure
A condition of base material in which a weave pattern of glass cloth is appearing on the surface though the unbroken fibres of the woven cloth are completely covered with resin.
Shiny Li
Jan 28,2016
1186
Wave Soldering
The technique of joining parts to a PCB by passing the assembly over a wave of molten solder so as to coat the pre-fluxed areas to be joined.
Shiny Li
Jan 28,2016
1203
Wave Exposure
A surface condition of base material in which the unbroken fibres of woven glass cloth are not completely covered by resin.
Shiny Li
Jan 28,2016
1235
Voltage Plane
A conductor or portion of a conductor layer on or in a printed board which is maintained at other than ground potential. It can also be used as a common voltage source, for heat sinking, or for shield...
Shiny Li
Jan 28,2016
1031
Viscosity
The property of a fluid that enables it to develop and maintain a level of shearing stress dependent upon the velocity of flow and then offer continued resistance to flow. The absolute unit of viscosi...
Shiny Li
Jan 28,2016
1132
Virtual Prototype
A virtual (computer model) representation of an electronic product that can be used to explore different design scenarios and then verify that the product will work as planned before building a physic...
Shiny Li
Jan 28,2016
954
Via
A plated through-hole used as an interlayer connection and not as a terminating point for a component lead. It may also be blind (incomplete penetration) or buried (non-surfacing).
Shiny Li
Jan 28,2016
977
Via Hole
A plated through-hole whose only purpose is to connect a track on one layer or side of the board through to a track on another layer or side. In a via, there is no intention to insert a component lead...
Shiny Li
Jan 28,2016
894
Vapour Phase
The solder re-flow process that uses a vaporized solvent as the source for heating the solder beyond its melting point,creating the component-to-board solder joint.
Shiny Li
Jan 28,2016
744
Vacuum Pick-up
A component handling tool with a small vacuum cup for ease of pick-up and removal during de-soldering.
Shiny Li
Jan 28,2016
759
Unsupported Hold
A hole containing no conductive material nor any other type of reinforcement.
Shiny Li
Jan 28,2016
676
Underwriters’ Symbol
A logotype authorized for placement on a product which has been recognized (accepted) by Underwriters Laboratories, Inc. (UL).
Shiny Li
Jan 28,2016
866
Undercut
A groove or excavation at one edge of a conductor caused by etching.
Shiny Li
Jan 28,2016
695
Ultrasonic Soldering
Fluxless soldering wherein molten solder is vibrated at ultrasonic frequencies while making the joint.
Shiny Li
Jan 28,2016
778
UL
Underwriter’s Laboratories, Inc., a corporation for the purpose of establishing safety standards on types of equipment or components in USA and Canada.
Shiny Li
Jan 28,2016
793
Twist
The deformation of a rectangular sheet, panel or printed board, that occurs parallel to a diagonal across its surface in such a way that one of the comers of the sheet is not in the plane formed by th...
Shiny Li
Jan 28,2016
832
Triazine
Dielectric material with higher glass transition temperature and better thermal stability than epoxy resin, however, more expensive and not in common use.
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