Engineering Technical

Ink materials for printed circuit boards (PCBs)

DuPont Microcircuit Materials (MCM) has developed a broad and growing portfolio of CB Series screen printed ink materials for rigid and flexible printed circuit boards (PCBs). Current offerings inclu...

Ink materials for printed circuit boards (PCBs)

Engineering Technical

circut board

Stands for "printed circuit board." A PCB is a thin board made of fiberglass, composite epoxy, or other laminate material. Conductive pathways are etched or "printed" onto board, connecting different ...

circut board

Engineering Technical

Single Sided Mixed Technology Reflow Process

A relatively new procedure has been developed to enable a single reflow operation to solder both surface mount and conventional through-hole components on the same board. This is particularly desirabl...

Single Sided Mixed Technology Reflow Process

Engineering Technical

Mixed Technology PCB Assembly

There are still components that are not available in surface mount configuration (for example, some connectors and capacitors). Therefore, some assemblies have through-hole and surface mount component...

Mixed Technology PCB Assembly

Engineering Technical

Double Sided PCB Assembly and Soldering

To achieve higher component density, the double-sided assembly technology has evolved. Double-sided circuit boards have copper tracking and component pads (land pattern) on the top and bottom side of...

Double Sided PCB Assembly and Soldering

Engineering Technical

Wave (Flow) Soldering Process

Since the introduction of automated PCB assembly and component lead soldering, wave soldering has been the mainstream method of applying solder automatically to the bottom side of PCBs. Wave soldering...

Wave (Flow) Soldering Process

Engineering Technical

PCB assembly enters reflow process

Since the introduction of automated PCB assembly and component lead soldering, wave soldering has been the mainstream method of applying solder automatically to the bottom The PCB is passed though the...

PCB assembly enters reflow process

Engineering Technical

Re-flow Soldering Process

Reflow soldering is the making of solder joints by (re) melting previously applied solder, usually in the form of a paste. A re-flow machine is a conveyorised oven that transports the pasted and compo...

Re-flow Soldering Process

Engineering Technical

Single Sided Surface Mount PCB Assembly

Single sided PCB assembly requires components to be assembled on only one side of the circuit board and is the least complex of PCB surface mount assembly processes. Double sided and variants of surfa...

Single Sided Surface Mount PCB Assembly

Engineering Technical

Solder Pasting and Printing (surface mount process)

To achieve accurate positioning of components, surface mount assembly PCBs must be designed to ensure that component pad (land pattern) dimensions and layout are in accordance with good practice and t...

Solder Pasting and Printing

Engineering Technical

Component Placement onto the Printed Circuit Board

The best-expected manual insertion rate of through-hole components is 200 to 400 components per hour. Automation has been a prime objective for printed circuit board assemblers since the electronics i...

Component Placement onto the Printed Circuit Board

Engineering Technical

Printed Circuit Board Designs

Fundamentally, there are two PCB design systems - through hole and surface mount. In through-hole process, components have connecting pins that are pushed through plated holes (vias) in the PCB and pr...

Printed Circuit Board

Engineering Technical

Surface-mount circuitry-PCB

Surface-mount circuitry of the PCBs does not require a hole for each component lead. Automated testing, however, may require vias on every node. The holes were never an issue with through-hole circuit...

Surface-mount circuitry-PCB

Engineering Technical

Through-Hole Considerations-PCB

The older technology for op amps and other components is through-hole. Components are constructed with leads that insert through holes in the board hence the name. Through-hole components, due to th...

Through-Hole Considerations-PCB

Engineering Technical

PCB Trace-to-Plane Capacitance Formula

For example, if the capacitance formula is applied to the following trace: 4 Layer board signal routing next to ground planeBoard layer thickness: 0.188 mmTrace Width: 0.75 mmTrace Length: 7.5 mm A ...

PCB

Engineering Technical

Trace Reflections-PCBs

Reflections and matching are closely related to loop antenna theory, but different enough to warrant their own discussion. When a PCB trace turns a corner at a 90 angle, a reflection can occur. This i...

Trace Reflections-PCBs

Engineering Technical

Board Stack-Up The Order of Layers

There has been a lot of confusion in the past over what is the optimum order for PCB layers. Take, for example, a 4-layer board consisting of two signal layers, a power plane, and a ground plane. Is i...

Board Stack-Up

Engineering Technical

Multi-Layer PCBs

Double-sided boards, in spite of their benefits, are not the best method of construction, especially for sensitive or high-speed designs. The most common board thickness is 1.5 mm. This separation is ...

Multi-Layer PCBs

Engineering Technical

Single-Sided PCBs

Very simple consumer electronics are sometimes fabricated on single-sided PCBs, keep-ing the raw board material inexpensive (FRC1 or FRC2) with thin copper cladding. These designs frequently include m...

Single-Sided PCBs

Engineering Technical

PC Board materials Materials Choosing the Right One for the Application

PC Board materials are available in various grades, as defined by the National Electrical Manufacturers Association (NEMA). It would be very convenient for designers if this organization was closely a...

PC Board materials Materials

Ranking Name Answers
Back to top